The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
Nov. 20, 2001
Applicant:
Inventors:
Katsuhiro Ando, Hyogo, JP;
Toru Inaya, Hyogo, JP;
Masato Kusakabe, Hyogo, JP;
Hiroshi Iwakiri, Hyogo, JP;
Assignee:
Kaneka Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 8/312 ; C08L 6/300 ; C08G 7/738 ;
U.S. Cl.
CPC ...
C08L 8/312 ; C08L 6/300 ; C08G 7/738 ;
Abstract
The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.