The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2004

Filed:

Oct. 02, 2001
Applicant:
Inventors:

Andrew J. Cobley, Coventry, GB;

Mark J. Kapeckas, Marlborough, MA (US);

Erik Reddington, Ashland, MA (US);

Wade Sonnenberg, Edgartown, MA (US);

Leon R. Barstad, Raynham, MA (US);

Thomas Buckley, Dedham, MA (US);

Assignee:

Shipley Company, L.L.C., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 ; C25D 3/38 ; C25D 3/00 ; C25D 3/48 ;
U.S. Cl.
CPC ...
C25D 3/56 ; C25D 3/38 ; C25D 3/00 ; C25D 3/48 ;
Abstract

A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.


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