The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Oct. 10, 2001
Donald S. Fritz, San Jose, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 26 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A stress inhibiting intermediate mounting substrate is connected to the chip carrier through a first array of solder connections. The stress inhibiting intermediate mounting substrate has a second coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the chip carrier and smaller than or equal to the coefficient of thermal expansion of the printed circuit board. Alternate preferred inventive embodiments allow for the cleaning and removal of residual flux and other debris in packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile