The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Apr. 12, 2001
Applicant:
Inventor:
Keith K. Sturcken, Nokesville, VA (US);
Assignee:
BAE Systems Information & Electronic Systems Integration, Inc., Nashua, NH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract
A high-density electronics package compromises a chip-stack having a plurality of ICs. Oblong-shaped bumps comprising an electrically-conductive bonding material are disposed along one side of each IC in the chip-stack. The one side of each IC bearing the bumps is aligned with the bump-bearing side of all other ICs in the chip-stack. A portion of each oblong-shaped bump extends beyond the edge of its host IC. This portion of each bump is available to electrically and mechanically connect the chip stack to the next packaging layer, such as a printed circuit board.