The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2004

Filed:

Feb. 21, 2003
Applicant:
Inventors:

Fumihiro Arakawa, Tokyo-To, JP;

Yasuhiko Ishii, Tokyo-To, JP;

Daisuke Hashimoto, Tokyo-To, JP;

Eiji Ohishi, Tokyo-To, JP;

Yukihiro Kyoden, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/502 ; B32B 1/508 ; B32B 3/10 ; B32B 3/24 ;
U.S. Cl.
CPC ...
B32B 1/502 ; B32B 1/508 ; B32B 3/10 ; B32B 3/24 ;
Abstract

A metallic foil and a transparent substrate film are laminated with an adhesive layer. The roughness of the adhesive-layer-side surface (lower surface) of the metallic foil is such that the maximum height Rmax is more than 0 and less than 4 &mgr;m. As long as the maximum height Rmax falls in the range, the adhesive layer never contains air bubbles in such sizes that reflectance is adversely affected. The roughness of the surface (upper surface) of the metallic foil, opposite the adhesive-layer-side surface, is preferably such that the arithmetic mean roughness Ra is between 0.02 &mgr;m and 1 &mgr;m. As long as the arithmetic mean roughness Ra is in this range, it is possible to efficiently conduct vacuuming to bring, into close contact, a photosensitive resin layer and a photomask in sheet form placed on the photosensitive resin layer, before effecting the pattern-wise exposure of the photosensitive resin layer.


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