The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Nov. 07, 2000
Roger L. Hipwell, Jr., Eden Prairie, MN (US);
Lee Walter, Plymouth, MN (US);
Wayne A. Bonin, North Oaks, MN (US);
Barry D. Wissman, Eden Prairie, MN (US);
Zine-Eddine Boutaghou, Vadnais Heights, MN (US);
Barbara J. Ihlow-Mahrer, Crystal, MN (US);
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.