The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2004

Filed:

Apr. 12, 2001
Applicant:
Inventors:

Takanori Kido, Nagano, JP;

Fumio Tsujino, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09C 1/68 ; C09K 3/14 ; H01L 2/1304 ; C09G 1/02 ; C09G 1/04 ;
U.S. Cl.
CPC ...
C09C 1/68 ; C09K 3/14 ; H01L 2/1304 ; C09G 1/02 ; C09G 1/04 ;
Abstract

The present invention can provide an abrasive composition for polishing a semiconductor device which composition contains water, microparticles of an abrasive, and a chelating agent, wherein the abrasive is cerium oxide; the microparticles of cerium oxide have an average particle size of 0.01-1.0 &mgr;m and which composition is used for suitably forming a shallow trench isolation structure in a well-controlled manner during planarization of a semiconductor device including element-isolated structure. The invention also provides a method for producing the semiconductor device by use of the abrasive composition.


Find Patent Forward Citations

Kido, Takanori. (2004). Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same (U.S. Patent No. 6733553). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6733553

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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