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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6733544 B1

PDFFull Text
Expired
Date of Patent:
May. 11, 2004

Filed:

Oct. 10, 2001

Method of producing electrical double layer capacitor and method of mounting electrical double layer capacitor on a circuit substrate

Applicant:
Inventors:

Shinichi Takasugi, Sendai, JP;

Yoshimi Kanno, Sendai, JP;

Shunji Watanabe, Sendai, JP;

Tsugio Sakai, Sendai, JP;

Yoshibumi Nakamura, Sendai, JP;

Hideharu Onodera, Sendai, JP;

Assignee:

SII Micro Parts Ltd., Miyagi, JP;

Attorney:

Adams & Wilks

Primary Examiner:

Ha Tran Nguyen

Int. Cl.
CPC ...
H01G 9/00 ; H01G 9/02 ;
U.S. Cl.
CPC ...
H01G 9/00 ; H01G 9/02 ;
Abstract

A method for producing an electrical double layer capacitor comprising the steps of assembling together components comprised of a positive electrode, a negative electrode, a non-aqueous solvent, an electrolyte containing a supporting salt, a separator, and a gasket to form a coin- or button-type electrical double layer capacitor, heating the assembled coin- or button-type electrical double layer capacitor so that a temperature profile of the heating step is approximately the same as a temperature profile of reflow soldering, and welding an outer connection terminal to the heated assembled coin- or button-type electrical double layer capacitor after the heating step.

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Takasugi, Shinichi. (2004). Method of producing electrical double layer capacitor and method of mounting electrical double layer capacitor on a circuit substrate (U.S. Patent No. 6733544). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6733544

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