The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Mar. 05, 2002
Applicant:
Inventor:
Ikuya Miyazawa, Suwa, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; B23K 3/512 ; B23K 1/08 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 3/512 ; B23K 1/08 ;
Abstract
A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.
Quick Actions:
Miyazawa, Ikuya. (2004). Soldering method, soldering device, and method and device of fabricating electronic circuit module (U.S. Patent No. 6732907). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6732907
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile