The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Jul. 31, 2000
Applicant:
Inventors:
Michiharu Motonishi, Niigata-ken, JP;
Michiaki Moroe, Niigata-ken, JP;
Assignee:
Alps Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 ; G11B 5/33 ; G11B 5/39 ; G11B 2/116 ; G11B 5/48 ;
U.S. Cl.
CPC ...
G11B 5/127 ; G11B 5/33 ; G11B 5/39 ; G11B 2/116 ; G11B 5/48 ;
Abstract
The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.