The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Mar. 20, 2000
Christopher W. Jones, Pleasanton, CA (US);
Brenor Brophy, San Jose, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A multi-chip integrated circuit assembly including embodiments having a plurality of integrated circuits connected thereto. According to one embodiment, a multi-chip assembly ( ) may include a first surface ( ) having first surface connections ( ) and a second surface ( ) having second surface connections ( ). A first surface ( ) may be lower than a second surface ( ). First and/or second surface connections ( and ) may have conductive paths to one another and/or to assembly connections ( ). In one particular arrangement, first and second surface connections ( and ) may provide “flip-chip” type connections to integrated circuits. Assembly connections ( ) may provide a ball grid array (BGA) type connection for the multi-chip assembly ( ).