The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Mar. 06, 2002
Applicant:
Inventors:
Hajime Koyama, Yokohama, JP;
Koichi Fukuda, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A semiconductor device is disclosed, which comprises a semiconductor substrate with which a circuit element is provided, an insulating layer which is provided on the semiconductor substrate and has a concave portion, a first conductive line layer which is provided at the concave portion in the insulating layer and has a first thickness, and a second conductive line layer which is provided at the concave portion in the insulating layer so as to be formed apart in a horizontal direction from the first conductive line layer and has a second thickness which is smaller than the first thickness.