The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Oct. 16, 2002
Yukio Yokoyama, Chiba, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A resin-formed substrate is provided which has a component side for mounting an electronic component thereon, and a solder side for soldering thereto a lead extending from the electronic component, which is the reverse to the component side, the resin-formed substrate comprising a metal frame forming an electronic circuit pattern; and a resin covering the metal frame, the resin having an aperture formed therein, for exposing a portion of the metal frame, wherein the portion of the metal frame exposed through the aperture serves as an electrode portion for mounting of the electronic component, wherein the resin has a rib integrally formed on the component side, thereby suppressing warp of the resin-formed substrate due to a temperature difference made between a component side and a solder side during soldering.