The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2004

Filed:

Aug. 31, 2001
Applicant:
Inventors:

Masayuki Tobita, Tokyo, JP;

Natsuko Ishihara, Tokyo, JP;

Naoyuki Shimoyama, Tokyo, JP;

Shinya Tateda, Tokyo, JP;

Assignee:

Polymatech Co., LTD, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/00 ; C08K 3/04 ; C08K 9/00 ; C08L 7/00 ; D01F 9/12 ;
U.S. Cl.
CPC ...
C08J 3/00 ; C08K 3/04 ; C08K 9/00 ; C08L 7/00 ; D01F 9/12 ;
Abstract

A thermally conductive polymer composition includes polymer matrix such as thermoplastic resin or thermoplastic elastomer and a graphitized carbon fiber which serves as a thermally conductive filler. The graphitized carbon fiber is made from a mesophase pitch. The mesophase pitch is spun, infusibilized, carbonized, pulverized, and graphitized to form powdery graphitized carbon fibers. Preferably, the graphitized carbon fibers have a diameter of 5-20 &mgr;m, an average particle size of 10-500 &mgr;m, and a density of 2.20-2.26 g/cm . The composition may be molded to form a thermally conductive molded article such as a thermally conductive sheet. The thermally conductive polymer composition and thermally conductive molded article have high thermal conductivity and transfer large amounts of heat from electric or electronic parts.


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