The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2004

Filed:

Nov. 13, 2002
Applicant:
Inventors:

Caroline M. Ylitalo, Stillwater, MN (US);

Richard L. Severance, Stillwater, MN (US);

Ronald K. Thery, New Brighton, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/04 ; C08K 5/10 ; C09D 1/110 ;
U.S. Cl.
CPC ...
C08K 5/04 ; C08K 5/10 ; C09D 1/110 ;
Abstract

Radiation curable inks with moderate amounts of solvent with low surface tension provide unique processability characteristics that allow ink jetted features to be formed and cured with excellent flow, adhesion, dot gain, compatibility, weatherability, and curing characteristics. In a representative printing method, an ink jettable ink composition is provided that includes one or more oligo/resins, a radiation curable, reactive diluent having a surface tension and 1 to 15 weight percent of a solvent component comprising a solvent having a surface tension. The solvent surface tension is no more than about, and preferably at least 2 dynes/cm less than, the surface tension of the reactive diluent. The ink composition is ink jetted onto the substrate to form an ink jetted feature. While at least a portion of the solvent is still present in the ink jetted feature, the ink jetted feature is exposed to an amount of curing energy under conditions effective to at least substantially cure the radiation curable component of the printed feature and to at least substantially dry the ink jetted feature.


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