The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Jan. 24, 2002
Yasuhiko Yamazaki, Toyota, JP;
Takayuki Shibata, Nagoya, JP;
Syuuji Murata, Chita-gun, JP;
Akihiro Yada, Yokkaichi, JP;
Ryouji Iwamatsu, Kuwana, JP;
Denso Corporation, Kariya, JP;
Abstract
The present invention provides a method for vibrating, melting and creating well-bonded resin parts. Pressing the resin parts is started and then the pressing force is increased sharply to a predetermined value and the resin parts are vibrated to heat the resin part contact surfaces. After heat generation is started, the pressing force is increased gradually to a time, when the vibrating of the resin parts is finished, to push out the heated resin material from the contact surfaces. This exposes the new surface of the resin material which is heated at a low degree and thus can prevent the resin material at the contact surface from excessive heat and degradation. Thereafter, the vibration of the resin parts is stopped to solidify the resin material which is not degraded and is in a uniform, melted state throughout the contact surfaces.