The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Feb. 22, 2002
Applicant:
Inventor:
Ikuya Miyazawa, Chino, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 1/100 ;
U.S. Cl.
CPC ...
B05C 1/100 ;
Abstract
A method of manufacturing an electronic circuit module includes flow soldering including preheating an interconnect substrate on which an electronic part is placed, and supplying molten solder to a first surface of the interconnect substrate, whereby the first surface is heated to a specific temperature, wherein the interconnect substrate is heated by the preheating so that a difference between a temperature of the first surface immediately before supplying the molten solder and the specific temperature at the time of supplying the molten solder is 100° C. or less.