The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2004

Filed:

Feb. 22, 2002
Applicant:
Inventors:

Mitsuo Sakakura, Tamagawa-Mura, JP;

Seiichi Kobayashi, Tamagawa-Mura, JP;

Tadayoshi Nagasawa, Tamagawa-Mura, JP;

Yutaka Noguchi, Tamagawa-Mura, JP;

Hiroyasu Mori, Tamagawa-Mura, JP;

Assignee:

Toko Kabushiki Kaisha, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 ;
U.S. Cl.
CPC ...
H01F 5/00 ;
Abstract

A laminated electronic component comprising: a plurality of parallel first conductive patterns, which are laminated via a magnetic layer to a plurality of parallel second conductive patterns, the first and second conductive patterns being alternately connected to each other via through-holes, thereby forming a spiral coil inside a laminated body, the axis of the spiral coil being parallel to a mount face; wherein the magnetic layer, provided between the plurality of first conductive patterns and the plurality of second conductive patterns, comprises non-magnetic sections which are provided at positions corresponding to ends of the conductive patterns and extend parallel to the axis of the coil, and a method for manufacturing the same.


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