The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Jul. 31, 2001
Applicant:
Inventors:
Tsutomu Takabayashi, Tokyo, JP;
Shizuo Morizane, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
Bump areas for signals are spread on upper and lower positions with respect to Vdd and Vss lines in an I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread in two directions. A greater number of I/O buffers can be accommodated without increasing the size of a semiconductor integrated circuit.