The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Sep. 17, 2001
Katsumi Sakabe, Kawanishi, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
The semiconductor device comprises a lead frame including a die pad portion for mounting a semiconductor element thereon and a board mounting portion for mounting a circuit board thereon, and a sealing resin for sealing the semiconductor element, the circuit board, the die pad portion and the board mounting portion. The lead frame further includes an anchoring region having a higher anchoring effect for the resin than that of each of the die pad portion and the board mounting portion between at least the die pad portion and the board mounting portion. The anchoring region enhances the adhesion of a sealing resin to a lead frame, to prevent the crack of a semiconductor device to be mounted on the lead frame and the disconnection of a bonding wire.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile