The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Sep. 28, 2001
Applicant:
Inventors:
Assignee:
Aisin Seiki Kabushiki Kaisha, Kariya, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/534 ; H01L 3/528 ; H01L 3/508 ; H01L 2/306 ; F25B 2/102 ;
U.S. Cl.
CPC ...
H01L 3/534 ; H01L 3/528 ; H01L 3/508 ; H01L 2/306 ; F25B 2/102 ;
Abstract
A thermoelectric module includes a case, a insulating base plate for a exoergic side, a insulating base plate for endoergic side, a first soldering layer which joins the insulating base plate for the exoergic side to the case via a first soldering material, and a second soldering layer which joins P-type and N-type semiconductor tips to the insulating base plate for an exoenergic side and a insulating base plate for an endoergic side, using second soldering material. The melting point temperature of the first soldering material for the first soldering layer is higher than the melting point temperature of the second material for the second soldering layer.