The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2004

Filed:

Nov. 25, 2002
Applicant:
Inventors:

Lionel Girardie, Eybens, FR;

Jean-Baptiste David, Saint Martin D'Heres, FR;

Assignee:

Memscap, Crolles, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/18244 ;
U.S. Cl.
CPC ...
H01L 2/18244 ;
Abstract

The invention relates to a process for fabricating electronic components incorporating an inductive microcomponent placed on top of a substrate. Such a component comprises: a layer ( ) of material having a low relative permittivity, lying on the top face of the substrate ( ); a number of metal turns ( ) defined on top of the layer ( ) of material having a low relative permittivity; and a copper diffusion barrier layer ( ) interposed between the metal turns ( ) and the layer of material having a low relative permittivity.


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