The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Jul. 11, 2002
Showa Highpolymer Co., Ltd., Tokyo, JP;
Abstract
A photosensitive resin composition according to the invention includes (A) a photosensitive resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a polymerizable unsaturated compound and/or a solvent, which photosensitive resin (A) is obtained by allowing an epoxy resin (a) to react with a compound (b) having one primary alcoholic hydroxyl group and one functional group selected from a carboxyl group and a secondary amino group per molecule and an unsaturated monobasic acid (c) to yield a reaction product (I) and allowing a saturated or unsaturated polybasic acid anhydride (d) to react with the reaction product (I). The photosensitive resin composition of the invention is used as a solder resist in printed circuit boards, can be satisfactorily developed in a dilute basic aqueous solution and can yield a cured film that is excellent in flexibility, water resistance, adhesion, solder heat resistance, electroless gold plating resistance and pressure cooker test (PCT) resistance.