The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2004

Filed:

Jun. 13, 2002
Applicant:
Inventor:

Jun Nishihara, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/00 ;
U.S. Cl.
CPC ...
B24B 5/00 ;
Abstract

There is disclosed is a chemical mechanical polishing apparatus having a inexpensive simplified configuration, which minimizes consumption of slurry material and securely enabling washing of a polishing pad. By virtue of the provision of the inventive slurry stoppers, the chemical mechanical polishing apparatus prevents slurry from vainly falling off from the polishing pad in the course of polishing a wafer, and yet, while washing the polishing pad, in order that slurry not to remain on the polishing pad, and yet, in order that an end of adjoining slurry stoppers can be disposed across predetermined intervals in the inner and outer directions of the polishing pad, a plurality of slurry stoppers are retained to the polishing pad across substantially equal angular intervals along external periphery of the polishing pad by applying adhesive agent for example.


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