The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Aug. 16, 2002
Takeshil Kato, Akishima, JP;
Koji Yoshida, Kokuounji, JP;
Toshinori Hirataka, Yokohama, JP;
Toshiaki Ishii, Hitachi, JP;
Kazuyuki Fukuda, Fujisawa, JP;
Tadaaki Ishikawa, Tsutiura, JP;
Toshimasa Miura, Fujisawa, JP;
Tsutomu Kono, Kawasaki, JP;
Kimio Tatsuno, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.