The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2004

Filed:

Jul. 02, 2002
Applicant:
Inventors:

Joseph F. Chiappetta, Shelton, CT (US);

James Jamra, Madison, CT (US);

Assignee:

C-COR.net Corp., State College, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/04 ;
U.S. Cl.
CPC ...
H01S 3/04 ;
Abstract

A semiconductor laser diode for transmitting optical signals in a telecommunications network is housed within a module supported adjacent to a thermoelectric cooling element that is mounted in thermally conductive contact with a heat sink. The cooling element is positioned externally on the surface of the module. The adjacent surface areas of the module and the cooling element are brought into thermal conductivity by a thermally conductive filler occupying the space between the module and the cooling element. The filler conforms to the configuration of the adjacent surfaces of the module and the cooling element to increase the thermal conductivity therebetween for maximum efficiency in the transfer of heat from the laser diode through the module to the cooling element and the heat sink. In response to a change in the temperature of the laser diode, the current applied to the cooling element is adjusted to increase or decrease the current and accordingly sink heat from the laser diode or supply heat to the laser diode. By removing the cooling element from internally within the laser module, the manufacturing cost of the laser module is substantially reduced.


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