The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2004

Filed:

Jan. 07, 2002
Applicant:
Inventors:

Kiyoshi Arita, Munakata-gun, JP;

Tetsuhiro Iwai, Kasuga, JP;

Shoji Sakemi, Ogoori, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ; B44C 1/22 ;
U.S. Cl.
CPC ...
H01L 2/1302 ; B44C 1/22 ;
Abstract

A method of plasma processing a silicon-containing object to be processed at a high etching rate without causing a surface of the object to have a hazy appearance, so that this surface can have an excellent visual quality. In the plasma processing method of etching the surface of the semiconductor wafer, gas containing sulfur hexafluoride and helium is used as a plasma-generating gas. A fluorine radical as an active substance which reacts with silicon of the surface of the semiconductor wafer, gaseous silicon tetrafluoride yielded by the reaction and a compound (SF ) of fluorine and sulfur that is generated as a reaction product are removed by the helium gas functioning as carrier gas. The helium gas prevents the reaction product from adhering to the surface of the wafer again.


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