The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2004
Filed:
Jan. 29, 2002
Applicant:
Inventors:
Assignee:
NGK Insulators, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 3/06 ; B29C 4/500 ; C23C 2/802 ;
U.S. Cl.
CPC ...
H01F 3/06 ; B29C 4/500 ; C23C 2/802 ;
Abstract
A method of manufacturing a honeycomb extrusion die has the steps of: preparing a die base metal in which a plurality of intersecting slits are arranged in a front surface thereof and a plurality of raw material feeding holes communicated with the slits are arranged in a back surface thereof; forming a plating layer on the die base metal by means of electrolytic plating; (1) and forming a TiCN layer on the plating layer by means of CVD (chemical vapor deposition); or (2) forming a TiN layer on the plating layer by means of CVD (chemical vapor deposition); and forming a TiCN layer on the TiN layer by means of CVD. In this manner, the honeycomb extrusion die is obtained.