The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2004
Filed:
Dec. 11, 1997
Applicant:
Inventors:
Atsushi Ishio, Aichi, JP;
Norio Shimasaki, Aichi, JP;
Masaru Tateyama, Aichi, JP;
Kazuhiko Kobayashi, Aichi, JP;
Assignee:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 2/708 ;
U.S. Cl.
CPC ...
B32B 2/708 ;
Abstract
An electroconductive, multilayered hollow molding comprising at least two thermoplastic resin layers, in which at least one layer is a layer of (a) a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin; one layer is a layer of (b) a thermoplastic resin composition consisting essentially of a thermoplastic resin other than a polyphenylene sulfide resin; and at least one of the layers is a layer of an electroconductive, thermoplastic resin composition comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.