The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2004
Filed:
Dec. 03, 2002
Souichi Katagiri, Kodaira, JP;
Kan Yasui, Kokubunji, JP;
Ryousei Kawai, Kodaira, JP;
Sadayuki Nishimura, Yokohama, JP;
Masahiko Sato, Kokubunji, JP;
Yoshio Kawamura, Kokubunji, JP;
Shigeo Moriyama, Tama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A film formed on a surface of a wafer on which an integrated circuit is to be constructed can be planarized by using a fixed abrasive tool regardless of the width of elements of a pattern underlying the film. The fixed abrasive tool is liable to form scratches in the surface of the film. A planarizing process of the present invention employs a fixed abrasive tool containing substances harder than the film to be planarized in a content of 10 ppm or below and having a mean pore diameter of 0.2 &mgr;m or below.