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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6721341 B1

PDFFull Text
Date of Patent:
Apr. 13, 2004

Filed:

Apr. 02, 2002

Mounting structure for semiconductor laser module

Applicant:
Inventors:

Takeshi Aikiyo, Tokyo, JP;

Toshio Kimura, Tokyo, JP;

Kohei Terada, Tokyo, JP;

Takahiro Okada, Tokyo, JP;

Takashi Koseki, Tokyo, JP;

Assignee:

The Furukawa Electric Co., Ltd., Tokyo, JP;

Attorney:

Lacasse & Associates, LLC

Primary Examiner:

Paul Ip

Assistant Examiner:

Tuan Nguyen

Int. Cl.
CPC ...
H01S 3/04 ;
U.S. Cl.
CPC ...
H01S 3/04 ;
Abstract

A semiconductor laser module is packaged on a mounting substrate through a thermal diffusion sheet member. The thermal diffusion sheet member is that having thermal conductivity where thermal conductivity in the surface direction is greater than that in the thickness direction. Specifically, the thermal diffusion sheet member is graphite, for example, and has a thermal conductivity of 300 W/m·K or greater in the surface direction.

Find Patent Forward Citations

Aikiyo, Takeshi. (2004). Mounting structure for semiconductor laser module (U.S. Patent No. 6721341). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6721341

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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