The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2004
Filed:
Apr. 14, 1998
Roy Henson, Pleasanton, CA (US);
FormFactor, Inc., Livermore, CA (US);
Abstract
A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Corresponding signal routing channels are provided in the signal layers and aligned with the cluster of blind vias in the power layers to permit routing of signal traces or signal circuitry therethrough. A method of manufacturing the multilayered printed circuit board includes assembling a first subassembly of power layers, forming a group of clustered power vias through the first subassembly, assembling a second subassembly of signal layers, combining the first subassembly with the second subassembly such that the clustered vias in the first subassembly align with signal routing channels in the second subassembly, forming signal vias that extend through the first and second subassemblies, and seeding or plating the power and signal vias.