The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2004
Filed:
May. 30, 2001
Ryuichiro Maeyama, Ebina, JP;
Yasuhiro Uehara, Ebina, JP;
Michiaki Yasuno, Ebina, JP;
Makoto Omata, Ebina, JP;
Fuji Xerox Co., Ltd., Tokyo, JP;
Abstract
A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface of a cylindrical substrate, and a layer of a heat-resistant resin is formed thereon. An accumulated body of the heat-resistant resin and the metallic thin film is peeled off from the substrate. The metallic thin film may be formed by electroplating, electroless plating or vapor deposition, or may also be formed by attaching a metallic foil having been prepared on an inner surface of the substrate. The heat-resistant resin layer is formed by injecting a polyamide acid solution in a rotational drum, and then formed by centrifugal forming by rotating the rotational drum on rollers under heating. After forming, imidization is conducted by heating and baking to form a film member of a thermosetting polyimide. The heat-resistant resin layer may be formed by centrifugal forming of a liquid crystal polymer under melting by heating in the rotational drum, or by centrifugal forming of a solution of aromatic polyamide.