The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Oct. 29, 2002
Keiichi Sawai, Fukuyama, JP;
Osamu Jinushi, Kasaoka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
In a semiconductor chip mounted in a semiconductor device, when an opening portion ( ) is formed in a surface protective film ( ) on a pad ( ), the opening portion ( ) is so formed as to have a plurality of openings ( ), each smaller than a tip diameter of a probe needle ( ) and arranged in a grid pattern or stripe pattern. In this configuration, electrical continuity is achieved between the probe needle ( ) and the pad ( ) through a bump electrode ( ) if the bump electrode is properly formed. Electrical continuity between the probe needle ( ) and the pad ( ) is prevented by the opening ( ) and is not achieved if the bump electrode ( ) is improperly formed.