The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Feb. 26, 2001
Leif Bergstedt, Sjömarken, SE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
The invention relates to a process for manufacturing a structure ( ) for a circuit board which comprises a plurality of supporting layers ( ), all of different materials, which supporting layers ( ) support electrically conducting patterns ( ). According to the process, the material for a first supporting layer ( ) is that material which has the highest melting point of the different materials for supporting layers, subsequent to which, beginning from the first supporting layer ( ), new supporting layers ( ) are arranged successively. As material for each new supporting layer ( ), a material is chosen with lower melting point than the supporting layer which is closest in the direction of the first supporting layer ( ). Each new supporting layer ( ) is attached to the structure ( ) by exposing the structure ( ) to a temperature which exceeds the melting point of the new supporting layer ( ) but is lower than the melting point for that supporting layer which is the closest in the direction of the first supporting layer ( ). Furthermore, on at least one side of each new supporting layer ( ) electrically conducting patterns ( ) are arranged, and the electrically conducting patterns ( ) on at least two supporting layers ( ) are connected to each other. The invention also relates to a circuit board manufactured according to this process.