The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Aug. 23, 2002
Masaki Waki, Satsuma, JP;
Fumitoshi Fujisaki, Satsuma, JP;
Masao Takehiro, Satsuma, JP;
Shinichiro Maki, Satsuma, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile