The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Jul. 05, 2001
Applicant:
Inventor:
Torsten Wipiejewski, Santa Barbara, CA (US);
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 3/104 ; H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 3/104 ; H01L 2/100 ;
Abstract
A method and an apparatus for shaping semiconductor surfaces, in which a semiconductor wafer with a surface to be shaped is clamped in-between two plates. In which case at least one plate has a negative form with respect to the desired form to be formed in a semiconductor surface and the semiconductor surface is pressed by the plates at an elevated temperature. The method can be used particularly advantageously for fabricating concave microlens structures in semiconductor surfaces.