The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
May. 26, 2000
Applicant:
Inventor:
Hyongsok Soh, Basking Ridge, NJ (US);
Assignee:
Agere Systems Inc, Allentown, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract
The specification describes interconnection techniques for interconnecting large arrays of micromechanical devices on a silicon platform. The problem of interconnection congestion is overcome by routing the interconnections through the substrate. The through interconnections are made by etching vias through the substrate by RIE, oxidizing the via sidewalls, and filling the vias with polysilicon.