The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2004

Filed:

Jun. 06, 2002
Applicant:
Inventors:

Koichi Ogawa, Kanagawa, JP;

Haruhiko Kondou, Ohita, JP;

Kei Takahashi, Ohita, JP;

Daizo Tabuchi, Kanagawa, JP;

Satoshi Kanazawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/904 ;
U.S. Cl.
CPC ...
B29C 4/904 ;
Abstract

Ethylene (co)polymers each having specified values of (a) density, (b) molecular weight distribution (Mw/Mn), (c) relationship between die swell (DS) and shear rate (&ggr;) in a region of shear rate ({dot over (&ggr;)}), (d) relationship between stress (&sgr;) and maximum stress (&sgr; max) in a stress-strain curve in uniaxial stretching, (e) the ratio of sample diameter to initial sample diameter and the time for sample breakage during uniaxial stretching under a constant tension, blow molding process in which the thickness of a parison is adjusted by using the said ethylene (co)polymer, and the method of improving fire resistance in moldings, laminates and hollow moldings made by using the same. The ethylene (co)polymers are excellent in drawdown resistance, puncture resistance, parison control response, pinch-off properties, durability, and fire resistance, by using it, parison thickness can be controlled freely in blow molding, and large blow moldings having complicated shapes excellent in durability and fire resistance can be obtained.


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