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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6716374 B1

PDFFull Text
Date of Patent:
Apr. 06, 2004

Filed:

Mar. 27, 2001

Clamp pressure control method for injection molding process

Applicant:
Inventors:

Hiroshi Yutani, Katano, JP;

Shinji Kadoriku, Takarazuka, JP;

Akira Yabe, Nabari, JP;

Tadao Murata, Sanda, JP;

Ryoma Murase, Higashiosaka, JP;

Assignee:

Matsushita Electric Industrial Co., Ltd., Osaka, JP;

Attorney:

Jordan and Hamburg LLP

Primary Examiner:

Mathieu D Vargot

Int. Cl.
CPC ...
B29D 1/100 ;
U.S. Cl.
CPC ...
B29D 1/100 ;
Abstract

An injection-compression molding apparatus includes a stationary mold provided with a nozzle for injecting molten resin, and a movable mold driven by a servo motor. In compressing the resin, high-speed position control of the movable mold is first performed, which is then switched to speed feedback control which enables delicate regulation of clamping pressure in accordance with pressure fluctuations in the resin.

Find Patent Forward Citations

Yutani, Hiroshi. (2004). Clamp pressure control method for injection molding process (U.S. Patent No. 6716374). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6716374

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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