The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Nov. 16, 2001
Applicant:
Inventors:
Yoichi Kimura, Tokyo, JP;
Hiroyasu Fukushima, Tokyo, JP;
Assignee:
Tokiwa Seiki Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 7/04 ;
U.S. Cl.
CPC ...
B21D 7/04 ;
Abstract
An apparatus and a method for manufacturing a thick-walled bent pipe with a simple structure at low production cost, which has durability and can manufacture an elbow material for piping with higher size accuracy, are provided. For this purpose, the manufacturing apparatus is a manufacturing apparatus comprising a presser die ( ) and a lower die ( ), in which the lower die ( ) includes a pair of bottom dies ( ) having meshing means ( ), and a pair of the bottom dies ( ) are allowed to rotate opposite to each other by the meshing means ( ), in connection with a descent of the presser die.