The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2004

Filed:

Oct. 16, 2001
Applicant:
Inventors:

Hideaki Watanabe, Kofu, JP;

Dai Yokoyama, Kofu, JP;

Toshiyuki Koyama, Yamanashi-ken, JP;

Hiromi Kinoshita, Yamanashi-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/300 ; H05K 1/300 ;
U.S. Cl.
CPC ...
H01R 4/300 ; H05K 1/300 ;
Abstract

An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.


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