The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Dec. 07, 1999
Adam Karl Himes, Richfield, MN (US);
Kevin Jon Schulz, Apple Valley, MN (US);
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
A printed circuit head interconnect of a head gimbal assembly (HGA) has different material thicknesses in different regions of the printed circuit head interconnect. The printed circuit head interconnect includes a lamination sheet of materials having dielectric materials and conductive materials. The regions which need to have a lower stiffness are made thinner than the rest of the regions. The rest of the regions are made thick and robust enough to support the HGA. A method of reducing the thicknesses of the printed circuit head interconnect includes applying a resist mask pattern having a plurality of openings with different sizes so as to obtain different thicknesses of the materials in different regions of the printed circuit head interconnect.