The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Feb. 25, 2002
Applicant:
Inventor:
Yutaka Ueno, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/304 ; H01L 3/10203 ;
U.S. Cl.
CPC ...
H01L 2/304 ; H01L 3/10203 ;
Abstract
A semiconductor device according to one embodiment includes a substrate, a semiconductor chip arranged on the substrate, a first electrode formed in the substrate and connected to the semiconductor chip, a concave portion provided on a side of the substrate, the concave portion being formed to a depth not to reach a top of the substrate from a back of the substrate, and at least part of the first electrode being exposed to the concave portion, and a metal layer formed on the at least part of the first electrode.
Ueno, Yutaka. (2004). Semiconductor device having leadless package structure (U.S. Patent No. 6713868). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6713868
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile