The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2004

Filed:

Sep. 02, 1999
Applicant:
Inventors:

Norito Umehara, Ibaraki, JP;

Masazumi Amagai, Oita, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element that is in thermal contact with the surface opposite the principal surface of the semiconductor chip One region of said heat-radiating element is externally exposed from the package that encloses the semiconductor chip The heat-radiating element is in thermal contact with a metal pattern that is formed on the substrate on which the semiconductor device is mounted. The heat from the semiconductor chip is transferred to the mounting substrate side via the heat-radiating plate and heat dissipation is conducted efficiently.


Find Patent Forward Citations

Umehara, Norito. (2004). Lead over chip semiconductor device including a heat sink for heat dissipation (U.S. Patent No. 6713851). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6713851

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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