The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Mar. 27, 2002
Applicant:
Inventors:
Baek-Kyun Jeon, Yongin-si, KR;
Dae-Ho Choo, Suwon-si, KR;
Hyung-Woo Nam, Yongin-si, KR;
Yong-Joon Kwon, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/638 ;
U.S. Cl.
CPC ...
B23K 2/638 ;
Abstract
Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.