The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6713644 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 30, 2004

Filed:

Oct. 03, 2002
Applicant:
Inventor:

Binh Thanh Nguyen, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 7/08 ; C07F 7/12 ; C07F 7/14 ; C07F 7/16 ;
U.S. Cl.
CPC ...
C07F 7/08 ; C07F 7/12 ; C07F 7/14 ; C07F 7/16 ;
Abstract

Chloropropylsilanes are prepared via hydrosilation of olefinic halides with organosilicon hydrides, in the presence of neat platinum free copper containing catalysts. Organosilicon hydrides such as triethylsilane, olefinic halides such as allyl chloride, and catalysts such as copper acetate, copper chloride, copper sulphate, copper hydroxide, copper nitrate, and copper cyanide, can be used in the process.


Find Patent Forward Citations

Nguyen, Binh. (2004). Hydrosilation with platinum free neat copper containing catalyst (U.S. Patent No. 6713644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6713644

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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