The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Dec. 13, 2001
Katsumi Shimada, Osaka, JP;
Nitto Denki Corporation, Osaka, JP;
Abstract
A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.