The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
May. 16, 2001
Applicant:
Inventors:
Jürgen Stumper, Vancouver, CA;
John Robert Gordon, Vancouver, CA;
Herwig Robert Haas, Vancouver, CA;
Kelvin Keen-Ven Fong, Burnaby, CA;
Assignee:
Ballard Power Systems Inc., Burnaby, CA;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/88 ; H01M 4/86 ; H01M 6/00 ; B05D 5/12 ; C23C 1/626 ;
U.S. Cl.
CPC ...
H01M 4/88 ; H01M 4/86 ; H01M 6/00 ; B05D 5/12 ; C23C 1/626 ;
Abstract
The present methods make fluid diffusion layers having reduced surface roughness. The methods used for adhering the loading material to the substrate surface can reduce the average surface roughness of the fluid diffusion layers, thereby reducing leaks in and damage to ion exchange membranes. When fluid diffusion layers and electrodes having reduced surface roughness are employed in membrane electrode assemblies, better reliability and performance are obtained. A method of calculating the surface roughness of a fluid diffusion layer may be used.