The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Aug. 01, 2002
Applicant:
Inventor:
Thomas R. Omstead, Fremont, CA (US);
Assignee:
Novellus Systems, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/128 ;
U.S. Cl.
CPC ...
H01L 2/128 ;
Abstract
A method of conductive copper lines in a semiconductor device is provided. A dielectric structure having a surface with recessed features formed therein is provided. A ruthenium oxide layer is deposited over the surface of the dielectric structure. A ruthenium oxide and metallic ruthenium bilayer is formed from the ruthenium oxide layer. Copper conductive lines are formed in the recessed features.
Omstead, Thomas. (2004). Method for obtaining adhesion for device manufacture (U.S. Patent No. 6713373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6713373
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile